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USD $1200.00 Status: In-Stock
H-Link/S-Link/Cable Kit-G3
PRODUCT OVERVIEW

Datapath PCI Express expansion link solution consists of HLink (Host Link) card, the ExCable and the SLink (Slave Link) card. This provides connectivity for multi PCIe motherboards and backplanes to enable lare system builds.

The HLink-G3 card is used to provide a high bandwidth PCI Express link from an upstream host to a downstream expansion unit. Used with the SLink-G3 and Datapath expansion backplanes, this card allows the construction of larger systems comprising of many more PCI Express card slots than can be accommodated in a single chassis.

The Gen.3 PCI Express technology and supoprt for 8 lanes, allows for very high data rates to be supported between system components, which has applications wherever there is a need for distributed computing across a PCI Express fabric. For data wall systems, this bandwidth equates to very high pixel transfer speeds, ensuring smooth, full frame rate video distribution between chassis. Peak bandwidths of up to 8GB/s can be achieved on both upstream and downstream links simultaneously.

When unplugged into an Express9 backplane, the extended PCI Express bus will link at PCIe 2.1 (Gen.2) signalling rates, providing a peak line bandwidth of 4GB/s both upstream and downstream.

To benefit from the full performance, we recommend that the SLink-G3 is used in conjunction with the Datapath family of Gen.3 backplanes which allows the full 8GB/s link speed, assuming the host slot (that accepts the HLink-G3 card) is capable of Gen.3 operation.
HLink-G3 Host Card

The low profile PCI Express plug-in card format allows the HLink-G3 to be used in compact server cases offering standard x8 PCIe slots, as well as a full height slot in a Datapath VSN host.



ExCable


A fully locking cabling system has been developed specifically for PCI Express expansion and can support the full PCIe 3.0 signalling speeds over the 1m copper Excable.



SLink-G3 Slave Card

The SLink-G3 card plugs into a standard PICMG1.3 system board slot in a downstream system backplane board. Typically the SLink-G3 would be used with the Datapath family of active backplanes that are available either as card products or as the heart of the Datapath VSN family wall controllers.
SPECIFICATION OF THE HLink-G3:

Board format PCI Express x8 plug-in card, 150mm x 85mm (half height & full height bracket options)
Connectors

1 x Locking iPass™ connector (8 lane)
1 x 6 way 2mm header for GENLOCK clock input
1 x 6 way 2mm header for GENLOCK clock output
Power consumption 5W maximum
Operating temperature 0 to 35°C, 32 to 96°F
Storage temperature -20 to 70°C, -4 to 158 °F
Relative humidity 5% to 90% non-condensing
Warranty                                         
3 years



SPECIFICATION OF THE SLink-G3:
Board format Half size PICMG 1.3, 168mm x 85mm 
Connectors

1 x Locking iPass™ connector (8 lane)
1 x 6 way 2mm header for GENLOCK clock output 
Power consumption 5W maximum
Operating temperature 0 to 35°C, 32 to 96°F
Storage temperature -20 to 70°C, -4 to 158 °F
Relative humidity 5% to 90% non-condensing
Warranty 3 years
Datapath HLink-G3 and SLink-G3 PCIe Bus Extension